3M AF42

Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg

3M AF42

Main features

  • Clear Structural Bondline
  • Clean Non Tack Layup
  • High Peel Toughened Film

Product Description

3M Thermal Bonding Film AF42 is a translucent, non-tacky epoxy thermoset film for structural attachment of metal, glass, and engineering-grade substrates in electronics assemblies. The 3 mil adhesive layer is supplied on a 6.5 mil brown paper liner for clean cutting and placement. Low flow supports bondline control during heat cure, and the adhesive cures clear. A 60 minute cure at 177 deg C develops the final bond, while alternate higher-temperature cycles support shorter processing times.

Key features

  • Clear Cured Bondline: The translucent film cures to a clear structural adhesive layer.
  • Non Tack Low Flow Handling: The preformed film supports clean placement and controlled flow during cure.
  • Heat Cured Structural Bonding: The epoxy film bonds compatible metals, glass, and engineering substrates.

Applications

Electronics assembly bonding, metal and glass attachment, and structural film bonding with a compatible heat-cure process.

Product Family

3M AF42

Catalog Product

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
ColorColor
Translucent
Mechanical Properties
ElongationElongation
350 %

Additional Information

Technical properties

As-supplied / before-processing properties

PropertyValueUnitMethod / condition
Base resinEpoxy-As supplied
Adhesive thickness3milNominal
Liner thickness6.5milBrown paper liner
TackNone-At room temperature
ColorTranslucent-Before cure
Room-temperature work life4weeksAt 21 deg C
Shelf life15monthsStored at 4 deg C
Technical properties

After-processing / final-state properties

PropertyValueUnitMethod / condition
ColorClear-After cure
Tensile strength4800psiCured film
Elongation250%Cured film
Modulus65000psiCured film
Overlap shear on etched aluminum4600psiASTM D1002; 3 mil bondline
Overlap shear on FR-42500psiASTM D1002; solvent-wiped substrate

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